TBK 504 is a compact, professional pneumatic heat press designed specifically for bonding FPC flexible circuit boards (e.g., screen and touch cables) in smart devices. It features a digital temperature control and timing system for precise heat application, paired with a stable pneumatic pressing system (including a pressure gauge) to ensure uniform downward force. This machine guarantees accurate alignment and high-reliability, void-free bonding, making it an essential tool for professional mobile device repair and quality control.
Pressing Accuracy: Plus or Minus 5 UM
Product Size: 40 x 35 x 37 cm
Product Weight: 14.6 kg
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