TBK Laser delivers precision laser soldering solutions engineered specifically for the mobile phone repair industry. Discover our advanced chip soldering laser machines – the ultimate tools for smartphone motherboard repair, BGA rework, IC chip replacement, and micro-soldering on delicate components like CPU, GPU, memory chips, connectors, and charging port modules.

 

Our laser soldering systems for phone repair eliminate the risks of traditional methods. Utilizing focused laser beam technology, they enable non-contact soldering with ultra-fine spot control (as small as 0.1mm). This prevents heat damage to surrounding PCB traces, nearby chips, and flex cables (FPC) – critical for repairing iPhone, Samsung, Huawei, and other high-density smartphone boards.

 

Key features for repair shops and microsoldering technicians:

 

Repair-focused: Ideal for BGA chip removal/reballing, replacing damaged ICs, jumper wire soldering, and touch IC repair.

 

Precision & Safety: Anti-static design protects sensitive components; visual alignment systems ensure pinpoint accuracy on miniature solder pads.

 

Efficiency Boost: Programmable soldering paths and rapid heating/cooling speed up phone board repair, increasing workshop throughput.

 

Versatility: Handles lead-free solder wire, solder paste, and preforms for diverse mobile phone soldering tasks.

 

Upgrade your phone repair toolkit with industry-leading laser soldering technology. Achieve reliable, factory-grade solder joints on iPhone logic boards, Android mainboards, and tablet PCBs. TBK Laser: Your trusted partner for professional-grade, high-precision laser soldering machines built for success in the competitive mobile phone repair business.