Logic Board Repair & Micro-Soldering Solution

Integrated Ecosystem for Chip-Level Diagnostics & Rework

1. Solution Overview & Workflow

A Standardized 3-Step Repair Protocol

The TBK Logic Board Solution is a systematic workflow designed to minimize human error and maximize repair yield. This ecosystem integrates Power Analysis, CNC Grinding, and Laser Soldering to create a seamless "Find, Remove, and Fix" process.

Technical Core: Laser Precision vs. Hot Air Heating

Why upgrade to Laser? Thermal control is the critical factor in board repair.

• Traditional Hot Air Guns: Rely on broad airflow heating. While standard, they require extensive technician experience. Improper temperature control poses a high risk of burning components or causing irreversible thermal damage. Additionally, the airflow creates a risk of blowing away microscopic components (01005 size) and applies unnecessary stress to surrounding sensitive parts like CPUs.

• TBK Laser Technology: Utilizes Non-Contact, Pinpoint Heating to deliver High Efficiency, Precision, and Safety:

  • Inherent Efficiency: Relying on concentrated laser energy, the heating mechanism itself is inherently more efficient than air convection, delivering instant heat exactly where needed.

  • No Airflow: Uses light energy instead of wind, ensuring tiny components stay perfectly still during removal or installation.

  • Targeted Energy: The laser heats only the specific solder joint, isolating the heat from adjacent areas to prevent accidental burning.

  • Batch Operation: The instant thermal response (instant on/off) allows for faster cooling and consistent results, making it the ideal solution for high-speed batch processing.

2. Step 1: Power Diagnostics & Fault Location

The first step in any logic board repair is understanding "why" the device failed. These tools visualize the invisible electrical signals.

TBK-218: 30V/10A Diagnostic Power Supply

The Logic Board's "Heart Monitor"

• Waveform Analysis: The 4.3" LCD screen displays real-time current boot sequences. By observing the waveform shape, technicians can quickly distinguish between a PMIC failure, a CPU short, or a software crash.

• Short-Circuit Burn-in: Capable of delivering up to 10A to quickly identify shorted capacitors on the main power rail.

TBK-D7: Multifunctional Curve Waveform Meter

Compact Data Analyzer

• Precision Logging: Ideal for detecting micro-amp level leakage current. Its compact design saves valuable desk space while providing professional curve analysis.

3. Step 2: Safe Component Removal & Preparation

Removing the damaged part is the highest-risk phase. We offer two safe paths: Physical Grinding for large chips and Laser Desoldering for small components.

TBK-928: Intelligent CNC Chip Grinding Machine

The Cost-Effective Solution for Chip Removal

• Physical Removal: Efficiently grinds away hard-glued chips (like NAND or CPU) layer by layer with 0.01mm accuracy.

• Zero Heat Risk: This method applies no heat, completely eliminating the risk of board delamination or disturbing solder joints on the opposite side.

Laser Desoldering (TBK-2206 / TBK R-2201)

No-Wind Removal for Small Components

• Safe Desoldering: Both Laser Stations can melt solder instantly without airflow, allowing you to lift 01005/0201 capacitors or resistors without blowing them away.

4. Step 3: Precision Soldering & Installation

The final step is establishing a reliable electrical connection using non-contact laser energy. Choose the workstation that fits your operational requirements.

Flagship Model | TBK-2206: Intelligent 4-in-1 Laser Station

Comprehensive Repair System

• Laser Soldering Application: Utilizes a focused laser beam to melt solder paste and weld components onto the pads. This method establishes a secure electrical connection without the airflow interference associated with traditional tools.

• Integrated Four-in-One Head: Combines a High-Definition Microscope, Thermal Imaging Camera, Adjustable Laser Heater, and Built-in Lighting into a single unit.

• Precise & Adjustable Heating: Provides constant temperature heating (100°C to 450°C) with an adjustable spot size from 5mm to 30mm, accommodating various component dimensions.

• Smart Fault Detection: The integrated thermal camera highlights high-temperature areas on a powered motherboard to assist in identifying potential faults.

• Durable Construction: Features an all-aluminum alloy body with multiple cooling fans for heat dissipation, supporting consistent performance during extended use.

• Operation Interface: Equipped with a 10-inch screen and straightforward controls, supplemented by a foot switch for hands-free activation.

Advanced Model | TBK R-2201: 4K Laser Soldering Station

High-Definition Visualization System

• 4K Clarity: Features a 4K microscope and dual screens for technicians requiring high-resolution visuals during the repair process.

• Micro-Soldering Capability: Suitable for specific micro-soldering tasks where visual detail is prioritized alongside laser heating.

5. Exclusive Laboratory Bundle

Equip Your Workshop with the Full Protocol Acquire the complete ecosystem—TBK-2206 (Flagship Laser) + TBK-928 (Grinding) + TBK-218 (Diagnostics)—at a preferred bundle price. This package upgrades your workshop from manual, experience-based repair to a standardized, data-driven industrial process.