TBK-2208 Desktop BGA X-Ray Machine for Non-Destructive PCB & IC Inspection

The TBK-2208 is a compact, desktop BGA X-ray machine designed for the non-destructive inspection of electronic components. It provides essential internal imaging for mobile phone repair technicians, quality control specialists, and PCB assembly professionals. This machine allows for detailed analysis of BGA solder joints, IC chips, and other components to accurately identify defects such as voids, bridging, and cold solder without damaging the part.

• Integrated Safety Shielding: The unit is constructed with an integrated, high-density heavy lead shielding chamber. This design fully contains X-ray emissions, ensuring a safe operating environment that complies with safety standards.

• High-Definition Imaging System: Equipped with a high-resolution display screen that delivers a clear and sharp view of the internal structures of the component being inspected. This allows for precise identification of microscopic defects.

• Intelligent Operating System: Features a streamlined, intelligent operating system designed for ease of use. The process is simplified with a one-click sample capture function, enabling operators to acquire images quickly and efficiently.

• Contactless & Non-Destructive Inspection: The TBK-2208 functions as an essential tool for non-destructive analysis. It performs inspection remotely ("contactless"), guaranteeing that the board or chip remains physically unaltered and undamaged throughout the entire process.