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TBK 2206 laser soldering & desoldering machine for phone motherboard IC removal

TBK 2206 laser soldering & desoldering machine for phone motherboard IC removal

TBK 2206 Intelligent Laser Desoldering Machine

Product Overview

TBK 2206 Intelligent Laser Desoldering Machine brings an innovative laser desoldering solution for circuit board repair. It features precise local heating, intelligent digital control, adjustable stable temperature, and targeted heating technology, setting a new industry standard for safe, high-success-rate motherboard maintenance.

Traditional Heat Gun vs. Laser Desoldering Machine

Drawbacks of Traditional Heat Gun Repair

  1. Uneven heating on PCB boards
  2. Uncontrollable heating coverage
  3. Blurry observation during operation
  4. Low repair success rate, easy to damage surrounding components

TBK 2206 Intelligent Laser Desoldering Machine

Product Overview

TBK 2206 Intelligent Laser Desoldering Machine brings an innovative laser desoldering solution for circuit board repair. It features precise local heating, intelligent digital control, adjustable stable temperature, and targeted heating technology, setting a new industry standard for safe, high-success-rate motherboard maintenance.

Traditional Heat Gun vs. Laser Desoldering Machine

Drawbacks of Traditional Heat Gun Repair

  1. Uneven heating on PCB boards
  2. Uncontrollable heating coverage
  3. Blurry observation during operation
  4. Low repair success rate, easy to damage surrounding components

Core Advantages of TBK 2206 Laser Repair

  1. Constant-temperature local heating
  2. Adjustable heating coverage area
  3. Built-in thermal imaging for fast fault detection
  4. Integrated HD microscope for clear observation
  5. Wide adjustable temperature range
  6. Auxiliary ring light for dark working environments
  7. High repair success rate with zero damage to peripheral circuits

Core Feature 1: Precise Local Laser Heating

The laser heating system delivers stable constant temperature only on the target component. Surrounding PCB circuits receive zero thermal radiation and will not be affected.

  • Adjustable heating range: 5~30mm, freely switch between tiny chips and large IC modules
  • Fast heating speed, clean solder melting without board warping or component damage

Core Feature 2: 4-in-1 Multifunctional Laser Head

The integrated laser head combines four essential functions in one compact module:

  1. HD Microscope: Adjustable focus for ultra-clear chip soldering observation
  2. Auxiliary Ring Light: Supplementary lighting for dim workspaces
  3. Constant-Temperature Laser Heating Module: Tune heating area according to component size
  4. Thermal Imaging Camera: Real-time temperature visualization for fault diagnosis

Core Feature 3: Wide Adjustable Constant Temperature

  • Temperature range: 100°C (minimum) ~ 450°C (maximum)
  • Flexible temperature tuning fits all types of solder paste, chips and PCB materials
  • Intelligent constant temperature control keeps heat stable during full desoldering process

Safety Reminder: Do not place hands under the red laser preview zone to avoid burns during operation

Core Feature 4: Thermal Imaging Fault Detection

Connect the PCB to power supply, the built-in thermal imager instantly highlights overheating fault points on the screen. Technicians can quickly locate short circuits, damaged capacitors and defective ICs without complex testing tools, making diagnosis faster, safer and more intuitive.

Core Feature 5: Zero Thermal Radiation Outside Heating Zone

Laser energy concentrates only on the target chip area. Peripheral resistors, capacitors and small components stay at room temperature, eliminating board deformation, pad peeling or component burnout issues common with hot air guns.

Core Feature 6: Full Aluminum Alloy Body & Powerful Heat Dissipation

  • Full aluminum alloy housing: Sturdy, anti-corrosion and durable
  • Multiple ventilation holes + dual built-in cooling fans
  • Efficient heat dissipation prevents overheating during long-hour continuous work, extending machine service life

Optional Motherboard Repair Kit

Match the machine with dedicated accessories for full PCB repair workflow:

  1. Vacuum Suction Pen: Effortlessly pick up tiny chips after desoldering
  2. Dual-Axis PCB Fixture: Securely fix circuit boards of all sizes during operation

Product Specifications

表格

Item Parameter Item Parameter
Brand TBK Model 2206
Input Voltage 110-220V Total Power 100W
Laser Power 45W Heating Range 5~30mm
Temperature Range 100~450°C Screen Resolution 1920*1080
Working Laser Distance 110mm Working Platform Size 320*200mm
Touch Screen Size 10-inch Net Weight 8kg
Machine Dimension 320280350mm Gross Weight 9.5kg
Package Dimension 390320420mm Display HD 10-inch Touch Screen

Control Panel Buttons

  1. Lens Switch: Toggle between microscope & thermal imaging
  2. Microscope Focus Adjustment
  3. Heating Area Size Adjustment
  4. Thermal Imaging Focus Adjustment
  5. Temp Knob: Set target heating temperature
  6. Light Knob: Control auxiliary ring light brightness
  7. Preview Button: Activate laser preview
  8. Start/Stop Button: Run or pause laser heating

Application Scenarios

Ideal for mobile phone motherboard repair, BGA chip desoldering, CPU/PMIC removal, micro-component replacement, PCB short-circuit fault detection, precision electronic circuit maintenance and other precision soldering works.

If you have more questions, write to us
Just leave your email or phone number in the contact form so we can send you a free quote for our wide range of designs!
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(TBK Laser Machine)Shenzhen Shenwangda Technology Co., Ltd.  was established in 2012. It is a high-tech enterprise integrating R&D and innovation, production, sales and service. 
Contact Us
Contact :TBK Team
Phone: +86 17724739584
Email: colin@tbklasermachine.com 
WhatsApp: +86 17724739584
Address: 14th Floor, Building 2, Yingtai Kehui Plaza, No. 8 Yingtai Road, Dalang Street, Longhua District, Shenzhen, Guangdong, China
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